SK Hynix starts work on $4 billion US HBM plant
SK Hynix broke ground on a $4 billion advanced-memory packaging facility in Indiana, its first US plant for high-bandwidth memory assembly. The company plans to begin mass production of next-generation HBM in the second half of 2029, connecting DRAM wafers made in South Korea with American AI-chip customers.
Why it matters
The plant brings a critical part of the AI hardware supply chain closer to US customers.
Sources
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Part of the August 29, 2026 brief.